TECHNET Archives

February 2014

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 26 Feb 2014 11:58:45 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (95 lines)
You are welcome Bob.

Steve Gregory, can your web page handle documents, or just photos?  If it 
can handle the document, I will send it and people can download from 
there. 

I will say that for those who have requested the white paper, it is 
technically still a draft pending formal review from the J-STD-001 
committee, but it has been peer reviewed by  about a dozen people I 
respect, so I doubt it would change much.

Doug Pauls



From:   Bob Wettermann <[log in to unmask]>
To:     "[log in to unmask]" <[log in to unmask]>, 
"TechNet E-Mail Forum" <[log in to unmask]>, "Bob Wetterman (Gmail)" 
<[log in to unmask]>
Date:   02/26/2014 10:15 AM
Subject:        RE: [TN] Class III Solder paste, Sn63, Water Soluble



Thanks?you are always thorough and professional in your replies!
 
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, February 26, 2014 9:53 AM
To: TechNet E-Mail Forum; Bob Wetterman (Gmail)
Subject: Re: [TN] Class III Solder paste, Sn63, Water Soluble
 
Bob, 
You have to read the whole section to understand the requirement.  You 
can't use a type IN (inorganic) flux to solder assemblies.  Way too 
dangerous unless you REALLY know what you are doing, and even then.... 

So, you can use water soluble fluxes, which fit in the OR designation in 
most cases, but if it is a halide-bearing (which is the L1 designation) 
flux, it is too active to be used as a low solids / no-clean flux.  If 
your water soluble flux is ORL1 or higher (e.g. ORM0, ORM1, ORH0, ORH1) 
you can still use it, but it has to be cleaned and you as the manufacturer 
have to have objective evidence that you clean sufficiently well to 
prevent electrochemical failures. That's what the "data demonstrating 
compatibility" means. 

If anyone is interested, I wrote a white paper for the IPC, which will be 
included as an appendix in IPC-J-STD-001 Rev F (sometime later this year), 
which discusses what "objective evidence" and "compatibility testing" 
means.  The upcoming J-STD-001, Rev F, as it stands now in draft, would 
point you to IPC-9202 as one possible way to show compatibility. 

Did I answer your question or neatly rhumba around it? 

Doug Pauls 



From:        Bob Wettermann <[log in to unmask]> 
To:        <[log in to unmask]> 
Date:        02/26/2014 09:24 AM 
Subject:        [TN] Class III Solder paste, Sn63, Water Soluble 
Sent by:        TechNet <[log in to unmask]> 




Technetters:

According to the JSTD

"Flux shall not (N1N2,Defect Class 3) conform to flux activity levels L0
and L1 of flux materials rosin (RO), resin (RE) or organic"

That being said who is doing class III work, complying with JSTD Class III
requirements and using a water soluble Sn63 paste? (Our std does not
comply) Can someone recommend a good paste?

Bob Wettermann
BEST Inc


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________





______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2