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February 2014

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Subject:
Re: BAKING OF COUPONS BEFORE INITIAL MICROSECTION
From:
Ramakrishnan Saravanan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Date:
Tue, 25 Feb 2014 19:17:29 -0600
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Baking is done @120 deg C for 6 hours. The PCBs are complied to ECSS standard. Initial recession shall not exceed 20% of total hole wall. Whether baking will hide the recession for initial micro section ?. regards,

R.Saravanan

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