Baking is done @120 deg C for 6 hours. The PCBs are complied to ECSS standard. Initial recession shall not exceed 20% of total hole wall. Whether baking will hide the recession for initial micro section ?. regards,

R.Saravanan




On Friday, 21 February 2014 9:39 PM, Louis Hart <[log in to unmask]> wrote:
 
I would not bake coupons which are not being thermally stressed.  One might ask, what baking parameters are you thinking of?

Incidentally, if I am correct, resin recession is not reason for rejection according to IPC-6012C, Table 3-9. Military specifications, if I am correct, do not allow resin recession.

Louis Hart


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Friday, February 21, 2014 9:46 AM
To: [log in to unmask]
Subject: [TN] BAKING OF COUPONS BEFORE INITIAL MICROSECTION

Deal all ,

Is it necessary to bake the PWB test coupon prior to initial micro section(with out stress). 

If the coupons are baked prior to initial micro section, does it gives false results like hiding resein recession etc .... 

regards,

R.Saravanan

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