I would not bake coupons which are not being thermally stressed.  One might ask, what baking parameters are you thinking of?

Incidentally, if I am correct, resin recession is not reason for rejection according to IPC-6012C, Table 3-9. Military specifications, if I am correct, do not allow resin recession.

Louis Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Friday, February 21, 2014 9:46 AM
To: [log in to unmask]
Subject: [TN] BAKING OF COUPONS BEFORE INITIAL MICROSECTION

Deal all ,

Is it necessary to bake the PWB test coupon prior to initial micro section(with out stress). 

If the coupons are baked prior to initial micro section, does it gives false results like hiding resein recession etc .... 

regards,

R.Saravanan

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