The danger of extraction of no-clean flux parts is inconsistency: if the parts has been in storage for long time, the extractable are not readily testable in short time (diffusion driven.. need to go through the skin of the oxidized flux surface).  Thou shall not use no-clean for intermediate process, such as components.  

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Larry Dzaugis
Sent: Wednesday, February 19, 2014 10:13 AM
To: [log in to unmask]
Subject: Re: [TN] Cleanliness testing at component level

 One IC manufacturer used a no clean flux on the components in its vented BGA package.
This was fine for the majority of its customers using a no clean process.

Cleaning the package was interesting as the Govt requirement was di water, the customer used a chemistry and would not provide a wavier.
It was an airborne device.

It was only after there were test failures were the various conflicting reports pulled out and received from the customer, supplier and agency.
An incoming spec would have helped.

Larry Dzaugis


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