I have reviewed the J-STD-001 several times but still have a question regarding a subcontractor who performs component level soldering operations for Class 3 hardware.


If the subcontractor is performing a soldering operation, then cleaning is required to remove flux residues (this is not  a no clean flux situation).

If the subcontractor is cleaning, then cleanliness testing is required.

The J-STD-001 does not really address the component level when it comes to the Post Soldering Cleanliness Designator (PSCD).

If a component is having its leads pre-tinned or a BGA being re-balled, then is it defaulted to a C-22 PSCD?

My position is yes but I can see where there might be arguments against this since the designator codes seem to speak to the assembly level and not the component level.

My concern is that there is considerable time lag between when component soldering operations are performed relative to the actual PWA process which does get checked for cleanliness.

Any input is appreciated.
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