 
| Sender: |
|
| X-To: |
|
| Date: |
Wed, 5 Feb 2014 18:51:23 -0500 |
| Reply-To: |
|
| Message-ID: |
<00b401cf22cd$2d8f2670$88ad7350$@com> |
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
7bit |
| In-Reply-To: |
|
| Content-Type: |
text/plain; charset="us-ascii" |
| MIME-Version: |
1.0 |
| Parts/Attachments: |
|
|
Jack,
Use ENEPIG surface finish. A bit pricey but pretty good for wire bonding.
Ken
_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.
[log in to unmask]
(407) 340-2668
www.saturnpcb.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?
newbie question:
Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for
us...
thanks,
Jack
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|
