One IC manufacturer used a no clean flux on the components in its vented
BGA package.
This was fine for the majority of its customers using a no clean process.

Cleaning the package was interesting as the Govt requirement was di water,
the customer used a chemistry and would not provide a wavier.
It was an airborne device.

It was only after there were test failures were the various conflicting
reports pulled out and received from the customer, supplier and agency.
An incoming spec would have helped.

Larry Dzaugis


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________