TECHNET Archives

February 2014

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Feb 2014 07:25:18 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
Re: IPC-TH650
From:
Douglas Pauls <[log in to unmask]>
Message-ID:
<[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
Content-Type:
text/plain; charset="US-ASCII"
MIME-Version:
1.0
Parts/Attachments:
text/plain (35 lines) 
As one of the chairs of the solder mask task group, I am not aware there 
IS an IPC Solder Mask Pin Hole Integrity Test Method.

Doug Pauls



From:   Victor Hernandez <[log in to unmask]>
To:     <[log in to unmask]>
Date:   02/19/2014 06:11 AM
Subject:        [TN] IPC-TH650
Sent by:        TechNet <[log in to unmask]>



Fellow TechNetters;

   What is the IPC Solder Mask Pin Hole Integrity Test number?

Victor,


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________




______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2