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Larry,
Not sure if this will help or not...
IPC-2226 Sectional Design Standard for High Density Interconnect (HDI)
Printed Boards
...may have more information that could help you.
Regards,
James Jackson
Oztronics
On 2014-02-21 10:32, Larry Brophy wrote:
> Just to clarify, I have a Class 3 design that I need to use a blind
> via that has a finished hole size of 6mil (or 4 if I go to laser)
>
> But in IPC-2221B page 99 Table 9-4 for blind vias, Class 3 minimum is
> 7.87mil
>
> Is there any way to use an 4/6 mil via and still be Class 3?
>
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