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February 2014

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DesignerCouncil <[log in to unmask]>
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Designers Council Forum <[log in to unmask]>
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Fri, 21 Feb 2014 13:10:06 -0600
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"(Designers Council Forum)" <[log in to unmask]>, [log in to unmask]
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James Jackson <[log in to unmask]>
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Larry,

Not sure if this will help or not...

IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) 
Printed Boards

...may have more information that could help you.

Regards,

James Jackson
Oztronics


On 2014-02-21 10:32, Larry Brophy wrote:
> Just to clarify, I have a Class 3 design that I need to use a blind
> via that has a finished hole size of 6mil (or 4 if I go to laser)
> 
> But in IPC-2221B page 99 Table 9-4 for blind vias, Class 3 minimum is 
> 7.87mil
> 
> Is there any way to use an 4/6 mil via and still be Class 3?
> 
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