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February 2014

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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Sat, 22 Feb 2014 05:41:49 -0600
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"(Designers Council Forum)" <[log in to unmask]>, Larry Brophy <[log in to unmask]>
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Larry Brophy <[log in to unmask]>
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James,

I have that.  However the only reference to Class 3 that in that document is for Plated Through Hole vias.  

From what I can find so far in IPC documents is any blind via under 7.87mil fails Class 3.

How can you therefore design a PCB with a fine pitch part BGA using a laser drill of 4 mil and meet Class 3 then?

Confused,

Larry

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