James,
I have that. However the only reference to Class 3 that in that document is for Plated Through Hole vias.
From what I can find so far in IPC documents is any blind via under 7.87mil fails Class 3.
How can you therefore design a PCB with a fine pitch part BGA using a laser drill of 4 mil and meet Class 3 then?
Confused,
Larry
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