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January 2014

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Subject:
From:
Karen Tellefsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karen Tellefsen <[log in to unmask]>
Date:
Thu, 30 Jan 2014 10:42:51 -0500
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85%RH at 130°C is higher than 1atm. so this condition must be pressurized. 
 I'm pretty sure moisture is adsorbed at surfaces and at equilibrium with 
the water vapor, but I don't know how much.  Sorry, no references.

Karen Tellefsen - Electrical Testing
Alpha / 109 Corporate Blvd./ S. Plainfield, NJ 07080
[log in to unmask]
908-791-3069




From:   Joyce Koo <[log in to unmask]>
To:     <[log in to unmask]>, 
Date:   01/30/2014 10:26 AM
Subject:        [TN] 130C 85RH
Sent by:        TechNet <[log in to unmask]>



Guys and Gals,
I know JEDEC and others got 130C 85RH HAST test.  What is the residence 
time of H2O on a hot surface of 130C?  I know the pressure cooker test is 
high pressure of 2atm to kept the H2O there, but is HAST got pressure or 
not, if it is, does 85RH resulting evaporation rapid enough from the 
surface?  What is boundary layer coverage (device surface/moisture) of 
H2O? Any reference will be greatly appreciated (if you do not have enough 
coverage and short residence time on surface, Is there any diffusion take 
place or ionic species got time to dissolve/react with the part?).  Many 
thanks in advance.
Best regards,

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


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