Jack,
if you are looking for design spec, you are out of luck. Depend upon the capillary design, and wire bonding machine, you have set of different can do, can't do, regarding clearance to adjacent components, cleanliness if it is direct chip on board, height differential (you might need deep access capillary), etc. etc. The nowadays WB machine are amazing (if you pay arms and legs). Get a good plasma clean machine prior to bonding, like March, you got to go. Check UMC website, the operators runs thousands parts a day, no sweat. Good luck. (if you are running low volume, get an CM-elite prototype house, set up from ground up for WB is a bit of too big a task. IMO).
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Wednesday, January 29, 2014 5:17 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?
Jack,
All good responses thus far - George's books will provide a great deal of process and reliability considerations, as well as some plating info. Mil Std 883 will define visual criteria, pull strengths, and ball shear strengths. ASTM F458, 459, and 1269 essentially repeat the Mil Std. I'm sure there is an IPC, JEDEC, or something spec which also repeats the Mil Std, but I'm an ol' Mil Std boy and I don't know what the other ones are, off the top of my head.
Can you clarify a bit more specifically what you are looking for?
Are you looking for plating detail, wire bonding process detail, design/layout details, packaging options etc.?
It is my observation that one doesn't want to just casually get into wire bonding. Checking things out is a good first step.
Steve Creswick
Sr Associate - Balanced Enterprise Solutions http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?
newbie question:
Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for us...
thanks,
Jack
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