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January 2014

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Wed, 29 Jan 2014 17:17:25 -0500
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Jack,

All good responses thus far - George's books will provide a great deal of
process and reliability considerations, as well as some plating info.  Mil
Std 883 will define visual criteria, pull strengths, and ball shear
strengths.  ASTM F458, 459,  and 1269 essentially repeat the Mil Std.  I'm
sure there is an IPC, JEDEC, or something spec which also repeats the Mil
Std, but I'm an ol' Mil Std boy and I don't know what the other ones are,
off the top of my head.

Can you clarify a bit more specifically what you are looking for?

Are you looking for plating detail, wire bonding process detail,
design/layout details, packaging options etc.?

It is my observation that one doesn't want to just casually get into wire
bonding.  Checking things out is a good first step. 


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?

newbie question:

Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for
us...

thanks,
Jack


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