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January 2014

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Subject:
Re: Wire Bonding Spec?
From:
"Ahmad, Syed" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ahmad, Syed
Date:
Wed, 29 Jan 2014 22:03:51 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (49 lines) 
It is available online.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Wednesday, January 29, 2014 3:36 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?

H Jack, Please refer to the book-- Wirebonding in Microelectronics- by George Harman


Thank-you
Mumtaz
858-795-0112
Peregrine  Semiconductor


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 1:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?

newbie question:

Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for us...

thanks,
Jack


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