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January 2014

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Subject:
Wire Bonding Spec?
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Wed, 29 Jan 2014 15:17:07 -0600
Content-Type:
text/plain
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text/plain (15 lines) 
newbie question:

Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB,
but this is a new subject for us...

thanks,
Jack


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