You should achieve a high hit rate with a 1.00 mm pad.  Talk to your Test Engineers on what their requirements are as this may be better or worse than the IPC standard.

IPC recommends a square pad to provide more area for the probe tip however in my experience a round pad results in less questions from subcontract assemblers querying what components are fitted to these pads and why don't they have solder paste, or worse, someone taking the initiative and adding back in the solder paste that's been "missed" for some reason.

Keep testpoints 0.6 mm away from other components for low profile components.  Taller components require more clearance.

It's all in IPC-2221A.

James

James Head BEng CID+ MIIE MIET
Senior PCB CAD Engineer
Crowcon Detection Instruments Limited
2 Blacklands Way
Abingdon Business Park
ABINGDON
OX14 1DY
Telephone: 01235 557700 extension 289
Fax: 07092024504
E-mail: [log in to unmask]
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