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December 2013

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Wed, 11 Dec 2013 22:05:41 +0200
Content-Type:
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text/plain (90 lines)
Can I have the draft for comments?


On Wed, Dec 11, 2013 at 4:21 PM, Louis Hart <[log in to unmask]> wrote:

> Raye, although not a guru, please allow me to comment.
>
>  Jason and Reuven I agree with. Further, I have put among the 6012
> committee comments a request to simplify those tables for inner and outer
> copper thickness. Most of those columns can be eliminated, I believe,
> allowing for easier interpretation by those charged with acceptance.
>
> IPC will circulate a draft of 6012 rev D after 1 Jan 2014 for industry
> review. I have already submitted some 20 requests for what I see as
> improvements.  Louis Hart
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rivera, Raye
> Sent: Tuesday, December 10, 2013 12:13 PM
> To: [log in to unmask]
> Subject: [TN] IPC-6012C Total Cu thickness
>
> Hello technet gurus,
>
> I have a question regarding total copper thickness for external conductors.
>
> 3.6.2.13 states only a requirement for total conductor thickness, that is
> foil + plating, and references table 3-12 for the appropriate values. There
> is no requirement for the foil thickness.
> Table 3-12 also has a column with heading:
>
> Absolute Cu Min. (IPC-4562 less 10% reduction)
>
> Does that column heading constitute a requirement?   Would using a copper
> foil less than the stated minimum constitute a rejectable condition even if
> total copper thickness meets requirements?
>
> Engineering  states that they only care about the total thickness from a
> functional point of view.
>
> I ask this because I have a difference of opinion with a colleague on the
> interpretation of the standard.
>
> Best regards,
> Raye Rivera
>
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*Reuven Rokah*

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