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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Wed, 11 Dec 2013 07:59:49 +0200
Content-Type:
text/plain
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text/plain (99 lines)
Agree


On Wed, Dec 11, 2013 at 2:38 AM, Jason Zhao <[log in to unmask]>wrote:

> Hi Raye,
>
> As a fabricator, I only consider total thickness as a requirement.
>
> Best Regards,
>
> Jason Zhao
> VP of North America Operations
> Sunshine Circuits
> 3400 Silverstone Drive, Suite 139, Plano, TX 75023
> US Cell 510-468-4412, China Cell 131-62722392
> High Mix, High Tech, Low-Mid Volume PCB Manufacturer
> www.sunshinepcbgroup.com
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rivera, Raye
> Sent: Tuesday, December 10, 2013 11:13 AM
> To: [log in to unmask]
> Subject: [TN] IPC-6012C Total Cu thickness
>
> Hello technet gurus,
>
> I have a question regarding total copper thickness for external conductors.
>
> 3.6.2.13 states only a requirement for total conductor thickness, that is
> foil + plating, and references table 3-12 for the appropriate values. There
> is no requirement for the foil thickness.
> Table 3-12 also has a column with heading:
>
> Absolute Cu Min. (IPC-4562 less 10% reduction)
>
> Does that column heading constitute a requirement?   Would using a copper
> foil less than the stated minimum constitute a rejectable condition even if
> total copper thickness meets requirements?
>
> Engineering  states that they only care about the total thickness from a
> functional point of view.
>
> I ask this because I have a difference of opinion with a colleague on the
> interpretation of the standard.
>
> Best regards,
> Raye Rivera
>
> QA Manager * Canoga Perkins
> 20600 Prairie Street * Chatsworth * CA 91311-6008
> 818-678-3872  * [log in to unmask]<mailto:[log in to unmask]>
>
>
>
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-- 

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*Reuven Rokah*

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