Mary Jane,

Limiting exposure time out of the bag prior to SMT reflow is especially critical for lead free processing.  Just a word of warning.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Diljit Matharu
Sent: Tuesday, December 10, 2013 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Moisture Level Determination of PCB

Have a look at IPC 1601.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of MaryJane Chism
Sent: Tuesday, December 10, 2013 9:21 AM
To: [log in to unmask]
Subject: [TN] Moisture Level Determination of PCB

Hi Group,

I have a question concerning the moisture level of a printed circuit board.

1) Does a printed circuit board have an MSL level? We have been treating the printed circuit as an MSL Level 3.
2) Should we consider the wave solder as a thermal event even though the wave carriers shield all areas of the printed circuit board except the specific through hole areas. We currently do but should we?

Any information you give will be helpful,

Thanks,

Mary Jane

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