Hi Lyon,
It will be interesting to see any phones you can have Steve post. Since you are not experiencing soldering issues on the second side reflow it doesn't sound like the reflow process is deteriorating the solderability of the OSP. Since only the test point on the bottom side has an issue it sounds more like there may be some contamination of the test point. I'm wondering if there could be a very thin layer of solder mask (i.e., so thin it still looks like OSP) on the test point.
Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: [log in to unmask]
[log in to unmask]
-----Original Message-----
From: Lyon Yuan [mailto:[log in to unmask]]
Sent: Saturday, December 07, 2013 9:06 PM
To: 'TechNet E-Mail Forum'; Wenger, George M. [Contractor]
Subject: RE: [TN] solder can not be extended on test point of OSP board
Hi George,
Sorry for the confused. Pls see my response as below. I don't know if the discoloration will be the root cause to cause the solder quality with test point
1. Does that mean that solder does not wet a test point feature on the bottom side of a board during the first reflow operation?
Lyon: yes, we only found solder quality with test point on first reflow(Bottom side). But Good solder quality of Other locations at Bottom side. Remark: all test points at Bottom side
2.Are you experiencing soldering problems during the second reflow operation or are there test points on the OSP board that don't wet with solder during the bottom side reflow.?
Lyon: We didn't find any solder quality on Top side after reflow. Only find solder quality with test points at Bottom side after reflow
Lyon Yuan
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Wenger, George M. [Contractor]
Sent: Sunday, December 08, 2013 9:53 AM
To: [log in to unmask]
Subject: Re: [TN] solder can not be extended on test point of OSP board
Hi Lyon,
Your email is a little confusing. In your first sentence you indicate that "solder can't extend on test point of bottom side of OSP boards". Does that mean that solder does not wet a test point feature on the bottom side of a board during the first reflow operation? You then go on to say "discoloration at top side after bottom side reflow." That seems to indicate that during the heating during the first reflow (i.e., bottom side) is causing the OSP features on the topside of the board to discolor most likely due to oxidation of the OSP coating. Are you experiencing soldering problems during the second reflow operation or are there test points on the OSP board that don't wet with solder during the bottom side reflow.?
Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: [log in to unmask]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Saturday, December 07, 2013 8:40 PM
To: [log in to unmask]
Subject: [TN] solder can not be extended on test point of OSP board
Dear All,
Recently, our SMT detected some failures with solder can't extend on test point of bottom side of OSP boards, all failures board with a common phenomenon and same date code: discoloration at top side after bottom side reflow. We suspected that the failure is related to OSP film quality issue.
But I don't know how to prove my suspected. I will send some pictures to Steve. So you all can see them.
Lyon Yuan
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