Hi George,

Sorry for the confused. Pls see my response as below. I don't know if the
discoloration will be the root cause to cause the solder quality with test
point

1. Does that mean that solder does not wet a test point feature on the
bottom side of a board during the first reflow operation?
Lyon: yes, we only found solder quality with test point on first
reflow(Bottom side). But Good solder quality of Other locations at Bottom
side. Remark: all test points at Bottom side

2.Are you experiencing soldering problems during the second reflow operation
or are there test points on the OSP board that don't wet with solder during
the bottom side reflow.?
Lyon: We didn't find any solder quality on Top side after reflow. Only find
solder quality with test points at Bottom side after reflow

Lyon Yuan


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
Wenger, George M. [Contractor]
Sent: Sunday, December 08, 2013 9:53 AM
To: [log in to unmask]
Subject: Re: [TN] solder can not be extended on test point of OSP board

Hi Lyon,

Your email is a little confusing.  In your first sentence you indicate that
"solder can't extend on test point of bottom side of OSP boards".  Does that
mean that solder does not wet a test point feature on the bottom side of a
board during the first reflow operation? You then go on to say
"discoloration at top side after bottom side reflow."  That seems to
indicate that during the heating during the first reflow (i.e., bottom side)
is causing the OSP features on the topside of the board to discolor most
likely due to oxidation of the OSP coating.  Are you experiencing soldering
problems during the second reflow operation or are there test points on the
OSP board that don't wet with solder during the bottom side reflow.?

Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: [log in to unmask]
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Saturday, December 07, 2013 8:40 PM
To: [log in to unmask]
Subject: [TN] solder can not be extended on test point of OSP board

Dear All,

 

Recently, our SMT detected some failures with solder can't extend on test
point of bottom side of OSP boards, all failures board with a common
phenomenon and same date code: discoloration at top side after bottom side
reflow. We suspected that the failure is related to OSP film quality issue.
But I don't know how to prove my suspected. I will send some pictures to
Steve. So you all can see them.

 

 

 

Lyon Yuan

 



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________