Hi Lyon,

Your email is a little confusing.  In your first sentence you indicate that "solder can't extend on test point of bottom side of OSP boards".  Does that mean that solder does not wet a test point feature on the bottom side of a board during the first reflow operation? You then go on to say "discoloration at top side after bottom side reflow."  That seems to indicate that during the heating during the first reflow (i.e., bottom side) is causing the OSP features on the topside of the board to discolor most likely due to oxidation of the OSP coating.  Are you experiencing soldering problems during the second reflow operation or are there test points on the OSP board that don't wet with solder during the bottom side reflow.?

Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Saturday, December 07, 2013 8:40 PM
To: [log in to unmask]
Subject: [TN] solder can not be extended on test point of OSP board

Dear All,

 

Recently, our SMT detected some failures with solder can't extend on test point of bottom side of OSP boards, all failures board with a common phenomenon and same date code: discoloration at top side after bottom side reflow. We suspected that the failure is related to OSP film quality issue.
But I don't know how to prove my suspected. I will send some pictures to Steve. So you all can see them.

 

 

 

Lyon Yuan

 



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