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December 2013

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Subject:
From:
Lyon Yuan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lyon Yuan <[log in to unmask]>
Date:
Sun, 8 Dec 2013 09:39:54 +0800
Content-Type:
text/plain
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text/plain (28 lines)
Dear All,

 

Recently, our SMT detected some failures with solder can't extend on test
point of bottom side of OSP boards, all failures board with a common
phenomenon and same date code: discoloration at top side after bottom side
reflow. We suspected that the failure is related to OSP film quality issue.
But I don't know how to prove my suspected. I will send some pictures to
Steve. So you all can see them.

 

 

 

Lyon Yuan

 



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