Agreed.  My only point was that when a board shop uses an electroless chemistry they have to pay close attention to controlling their plating process and if they don't bad things can happen.

Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
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-----Original Message-----
From: Vladimir Igoshev. PhD [mailto:[log in to unmask]] 
Sent: Tuesday, December 03, 2013 5:25 PM
To: Wenger, George M. [Contractor]
Cc: [log in to unmask]
Subject: Re: [TN] Separation between the BGA sodler ball and pad on the PCB

Hello George,

I can hear your pain and tend to agree that we also see more failures on electroless finishes. Interestingly enough, not all types of failures on the same ENIG were due to the poor ENi and/or IAu application.

 However, those t=finishes have their own pros and if a board shop does a good job, then everything should be fine.

--
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca


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