And how would you capture them during production, Dr. Igoshev?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD
Sent: Thursday, December 26, 2013 12:18 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-610E, Voids in Thermal exposed pad of QFNs

Well, in essence a solderability issue as it's about the ability of a given QFN to be soldered and that ability will depend on the design, the process etc. In many cases with various components a component would easily pass the solderability test but fail to be soldered!

And it we won't call those defects 'voiding" then may be everyone will realize that it's a different type of defect and won't rely on X-ray trying to capture it.

--
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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