Because it is easier to call it a void than to say empty, vacant, blank, bare, clear, free unfilled, unoccupied, uninhabited.  It is an area void of solder.  Everything we've done with QFN soldering suggests that these "solder void" areas are due to a soldering issue and not a solderability issue.  You can usually take a QFN off that has terrible voiding and do a solderability test and you find it is solderable which is an indication that the "voiding" wasn't due to a solderability issue but a soldering issue.

Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: [log in to unmask]
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD
Sent: Thursday, December 26, 2013 9:22 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-A-610E, Voids in Thermal exposed pad of QFNs

I realized that. What I didn't understand was why it was "called"
voiding.

  

--
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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