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December 2013

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Subject:
IPC-A-610E, Voids in Thermal exposed pad of QFNs
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Fri, 20 Dec 2013 08:45:14 +0200
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text/plain
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Hi TechNets,

I didn't see in the IPC-A-610E any acceptability reference in regards with
the percentage of voids in solder joints of exposed thermal pads of QFNs or
other components with exposed thermal pads.

I recommend to add it in the next revision.


-- 

Best Regards,

*Reuven Rokah*

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