Hi TechNets,
I didn't see in the IPC-A-610E any acceptability reference in regards with
the percentage of voids in solder joints of exposed thermal pads of QFNs or
other components with exposed thermal pads.
I recommend to add it in the next revision.
--
Best Regards,
*Reuven Rokah*
Mobile: 972-52-6012018
Tel: 972-3-9360688
Fax: 076-5100674
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