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November 2013

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 14 Nov 2013 13:01:32 +0200
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Ozone cleaning works by ozone molecules breaking down into diatomic and 
monoatomic oxygen. The monoatomic oxygen has sufficient energy to break 
H-C covalent bonds and thus to convert organic molecules into H2O and 
CO2. A much tighter bond (e.g. C-F) would not be broken down. If the 
contamination is a pure H-C substance then the process would be 
effective. If it is one with other atoms, it may or may not be so 
effective. Your problem is that the surface of an epoxy resin also 
contains H-C bonds, so that ozone cleaning may degrade the resin 
structure of your laminate. It is principally used on inorganic 
substrates; fine for glass, silicon chips and ceramic hybrids.

Brian

On 13.11.2013 19:08, Richard Kraszewski wrote:
> Are any of you familiar with UV-Ozone cleaning processes?  I am considering using Plasma to clean some PCA's prior to coating to improve wetting of coatings, but now wonder if I should also consider UV-Ozone.
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> Anyone care to state some pros and cons of each for my application?
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> Suprisingly enough, I don't see any mention of UV-Ozone cleaning in the IPC -CH65B handbook.
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> Thanks
>
> Rich Kraszewski / Plexus
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