We have a customer in Korea using Samtec “Solder Charge” connectors.  The
alloy is SAC38 ( 95.5, 3.8, 0.7). 

They want to stay Pb-free.  

 

Our 60 layer, 480mm by  585 mm by  6.5 mm thick board, with  6100+ embedded
capacitors cannot survive the Z axis expansion seen at SAC reflow.  Test
samples have survived 10 reflows at 210°C.  

 

Has anyone tried to qualify the performance of SAC solder with SnBi solder
paste?  Does it have the same problems associated with mixing SAC and SnPb
paste? 

 

Thanks, 

Guy


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