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November 2013

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Wed, 6 Nov 2013 07:32:32 +0200
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Pls send a relevant cross section photo


On Wed, Nov 6, 2013 at 2:03 AM, Phil Bavaro <[log in to unmask]>wrote:

> I know what the spec limits are for wicking and I have a coupon that just
> barely violates the maximum requirement for class 3A.
>
> I was asked what kind of failure this would lead to if it were used and I
> could not answer the question.
>
> I researched the Technet archives and found an email from Paul Reid where
> he stated:
>
> "The worst-case condition is a short between holes drilled on a tight
> grid.  The most insidious condition that wicking is a site for CAF
> (conductive anodic filament) growth."
>
> There is no tight grid on this board so the short between holes is not
> going to happen.  CAF is always a concern but I would have thought that a
> failure would be related to some kind of stress point mechanism of failure
> based on how rough the hole looks.  I know a picture would make this a lot
> easier but I am not at liberty to release it.  The copper in the hole is
> very thick but the entire hole looks like it had a bad drill and overly
> agressive desmear operation.  There is wicking all up and down the wall of
> the hole but only excessive in length in one spot.
>
> So the question is:  How does excessive wicking cause a failure?  This was
> the kind of question that I used to send to Werner to get further education
> on.
>
> Any and all comments are appreciated.
>
> Phil
>
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