Joyce,
 
I think you nailed it.
 
Immersion coatings have excellent copper coverage characteristices (due to displacement reactions) but are also VERY thin. If you push for higher deposit thickness (like everyone always wants) you get issues.
 
Victor, you could run an SEM and energy dispersive x-ray map of the surface and pin it to the patent.
 
XRF as you've been advised is a fun task indeed. This is probably a new formulation, so there might be issues finding good cal standards for the XRF. I think our friend George O'Brien would have something useful to say on XRF for you if he's lurking.
 
Good hunting,
 
Gerry
 

 
> Date: Wed, 20 Nov 2013 20:17:22 +0000
> From: [log in to unmask]
> Subject: Re: [TN] Final Surface finish
> To: [log in to unmask]
> 
> Whiskeys free immersion tin coating?  Like this? 
>  http://www.google.com/patents/EP2494094A2
> 
> Joyce Koo
> Researcher
> Materials Interconnect Lab
> Office: (519) 888-7465 79945
> BlackBerry: (226) 220-4760
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Wednesday, November 20, 2013 3:03 PM
> To: [log in to unmask]
> Subject: Re: [TN] Final Surface finish
> 
> This final surface finish does NOT appear to be a HASL process.  Unless, the air knives pressure was so high that it did not leave ANY RIPPLES of the copper pad surface.
> Victor,
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
> Sent: Wednesday, November 20, 2013 1:52 PM
> To: [log in to unmask]
> Subject: Re: [TN] Final Surface finish
> 
> Theoretically also PB-free HASL, I say theoretically because the usual alloy is Sn/Cu or modified Sn/Cu on cost grounds.
> 
> Regards
> 
> Mike Fenner
> Bonding Services & Products
> M: +44 [0] 7810 526 317
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
> Sent: Wednesday, November 20, 2013 5:19 PM
> To: [log in to unmask]
> Subject: Re: [TN] Final Surface finish
> 
> Immersion Tin?
> Ag is known to be the anti-whisker additive for most chemistries.
> Best regards,
> 
> Arnaud Grivon
> PCB/PCBA Technology Expert
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> [@@ THALES GROUP INTERNAL @@]
> 
> 
> -----Message d'origine-----
> De : TechNet [mailto:[log in to unmask]] De la part de Victor Hernandez Envoyé : mercredi 20 novembre 2013 18:15 À : [log in to unmask] Objet : [TN] Final Surface finish
> 
> Fellow TechNetters:
> 
>    Is there a final surface finish which has a high tin content along with
> some silver.   It is not the traditional ImAg.   The finish appears somewhat
> dull with good coverage on the edges of copper features.
> 
> Victor,
> 
> 
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