Anyone checked link? It is a patent of Ag-Sn immersion surface finishing claim to be whiskers free.   Phil and I can drink 40 % green label when we meet. You guys are welcome to join and bring your mountain dew


Sent from my BlackBerry Z10.
  Original Message
From: Brian Ellis
Sent: Thursday, November 21, 2013 3:20 AM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] NTC RE: [TN] Final Surface finish


Alcohol is not a very good solvent for cleaning printed circuits unless you are sure all contamination is 100% alcohol-soluble

Brian

Phil Bavaro <[log in to unmask]> wrote:

>I am pretty sure I used alcohol after my finals on circuit theory when I was younger.....
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
>Sent: Wednesday, November 20, 2013 1:26 PM
>To: [log in to unmask]
>Subject: Re: [TN] NTC RE: [TN] Final Surface finish
>
>Next thing you know, someone will suggest it as a cleaning solvent for electronic circuit card assemblies.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
>Sent: Wednesday, November 20, 2013 3:01 PM
>To: [log in to unmask]
>Subject: [TN] NTC RE: [TN] Final Surface finish
>
>Whiskeys? Ripple? YIKES! Next someone will be talking about using alcohol for something or other!
>
>Ed Popielarski
>Engineering Manager
>
>
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>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
>Sent: Wednesday, November 20, 2013 12:17 PM
>To: [log in to unmask]
>Subject: Re: [TN] Final Surface finish
>
>Whiskeys free immersion tin coating?  Like this?
> http://www.google.com/patents/EP2494094A2
>
>Joyce Koo
>Researcher
>Materials Interconnect Lab
>Office: (519) 888-7465 79945
>BlackBerry: (226) 220-4760
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
>Sent: Wednesday, November 20, 2013 3:03 PM
>To: [log in to unmask]
>Subject: Re: [TN] Final Surface finish
>
>This final surface finish does NOT appear to be a HASL process.  Unless, the air knives pressure was so high that it did not leave ANY RIPPLES of the copper pad surface.
>Victor,
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
>Sent: Wednesday, November 20, 2013 1:52 PM
>To: [log in to unmask]
>Subject: Re: [TN] Final Surface finish
>
>Theoretically also PB-free HASL, I say theoretically because the usual alloy is Sn/Cu or modified Sn/Cu on cost grounds.
>
>Regards
>
>Mike Fenner
>Bonding Services & Products
>M: +44 [0] 7810 526 317
>T: +44 [0] 1865 522 663
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
>Sent: Wednesday, November 20, 2013 5:19 PM
>To: [log in to unmask]
>Subject: Re: [TN] Final Surface finish
>
>Immersion Tin?
>Ag is known to be the anti-whisker additive for most chemistries.
>Best regards,
>
>Arnaud Grivon
>PCB/PCBA Technology Expert
>Thales Global Services - ESS (Engineering Shared Services) 18, avenue du Maréchal Juin Bât. C - Bureau C2-135
>92366 Meudon-la-Forêt Cedex
>France
>Tél : (+33) (0)1 70 28 23 88
>
>Visit our website : http://www.thalesgroup.com
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>[@@ THALES GROUP INTERNAL @@]
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>
>-----Message d'origine-----
>De : TechNet [mailto:[log in to unmask]] De la part de Victor Hernandez Envoyé : mercredi 20 novembre 2013 18:15 À : [log in to unmask] Objet : [TN] Final Surface finish
>
>Fellow TechNetters:
>
>   Is there a final surface finish which has a high tin content along with
>some silver.   It is not the traditional ImAg.   The finish appears somewhat
>dull with good coverage on the edges of copper features.
>
>Victor,
>
>
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