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November 2013

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 20 Nov 2013 21:25:45 +0000
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Next thing you know, someone will suggest it as a cleaning solvent for electronic circuit card assemblies.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
Sent: Wednesday, November 20, 2013 3:01 PM
To: [log in to unmask]
Subject: [TN] NTC RE: [TN] Final Surface finish

Whiskeys? Ripple? YIKES! Next someone will be talking about using alcohol for something or other!

Ed Popielarski
Engineering Manager


                               970 NE 21st Ct.
                              Oak Harbor, Wa. 98277

                              Ph: 360-675-1322
                              Fx: 206-624-0965
                              Cl: 949-581-6601

https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&spn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, November 20, 2013 12:17 PM
To: [log in to unmask]
Subject: Re: [TN] Final Surface finish

Whiskeys free immersion tin coating?  Like this? 
 http://www.google.com/patents/EP2494094A2

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, November 20, 2013 3:03 PM
To: [log in to unmask]
Subject: Re: [TN] Final Surface finish

This final surface finish does NOT appear to be a HASL process.  Unless, the air knives pressure was so high that it did not leave ANY RIPPLES of the copper pad surface.
Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Wednesday, November 20, 2013 1:52 PM
To: [log in to unmask]
Subject: Re: [TN] Final Surface finish

Theoretically also PB-free HASL, I say theoretically because the usual alloy is Sn/Cu or modified Sn/Cu on cost grounds.

Regards

Mike Fenner
Bonding Services & Products
M: +44 [0] 7810 526 317
T: +44 [0] 1865 522 663
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
Sent: Wednesday, November 20, 2013 5:19 PM
To: [log in to unmask]
Subject: Re: [TN] Final Surface finish

Immersion Tin?
Ag is known to be the anti-whisker additive for most chemistries.
Best regards,

Arnaud Grivon
PCB/PCBA Technology Expert
Thales Global Services - ESS (Engineering Shared Services) 18, avenue du Maréchal Juin Bât. C - Bureau C2-135
92366 Meudon-la-Forêt Cedex
France
Tél : (+33) (0)1 70 28 23 88

Visit our website : http://www.thalesgroup.com

[@@ THALES GROUP INTERNAL @@]


-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Victor Hernandez Envoyé : mercredi 20 novembre 2013 18:15 À : [log in to unmask] Objet : [TN] Final Surface finish

Fellow TechNetters:

   Is there a final surface finish which has a high tin content along with
some silver.   It is not the traditional ImAg.   The finish appears somewhat
dull with good coverage on the edges of copper features.

Victor,


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