We have a customer in Korea using Samtec “Solder Charge” connectors. The
alloy is SAC38 ( 95.5, 3.8, 0.7).
They want to stay Pb-free.
Our 60 layer, 480mm by 585 mm by 6.5 mm thick board, with 6100+ embedded
capacitors cannot survive the Z axis expansion seen at SAC reflow. Test
samples have survived 10 reflows at 210°C.
Has anyone tried to qualify the performance of SAC solder with SnBi solder
paste? Does it have the same problems associated with mixing SAC and SnPb
paste?
Thanks,
Guy
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