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October 2013

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Subject:
From:
Richard Krug <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Krug <[log in to unmask]>
Date:
Tue, 1 Oct 2013 15:41:58 +0000
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Due to business acquisitions we now have an assembly that has been assembled using SMT adhesive followed by wave soldering.  
I know larger multilayer ceramic capacitors are subject to cracking due to thermal shock.  Is there a similar concern with large chip resistors.  

Dick Krug, CSSBB, CSMTPE
Senior Process Engineer
Sparton Complex Systems
30167 Power Line Road
Brooksville, FL  34602-8299
p (352) 540-4012  (Internal Ext. 2012)
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