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October 2013

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Subject:
From:
Steven Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:
Tue, 8 Oct 2013 10:54:03 -0400
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text/plain
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Hi Joyce,
Bottom side of the flex will have a kapton/polyimide coverlay with exposed vias. Regards Steve

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: October-08-13 10:53 AM
To: 'TechNet E-Mail Forum'; Steven Kelly
Subject: RE: Thermally conductive adhesive/epoxy

If you want to bond parts and followed by ultrasonic bonding, you don't want gummy stuff.  How much money you have?  BN or diamond filled might be on the order.  To bond flex - polyimide or copper pads?  Totally different requirements.    

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Tuesday, October 08, 2013 10:22 AM
To: [log in to unmask]
Subject: [TN] Thermally conductive adhesive/epoxy

Good Morning All,
I am looking for some kind of thermally conductive system to bond a piece of Aluminum onto a flex circuit. The Aluminum will act as a heat sink/spreader. We will then SMT some parts on the top of the flex and then ultrasonic bond a flip chip. If a supplier wants to contact me offline-  (416) 750-8433.
Thanks. Steve Kelly


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