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October 2013

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Tue, 8 Oct 2013 14:44:20 +0000
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Hi Steve-

Just as a guideline:
When bonding circuit boards together for thermal transfer, all of the available adhesives stink.  The most effective design technique is to have a large area, thin, adhesive bond which will be durable throughout the system life.  So if you can bond the aluminum with the thinnest high temperature sheet acrylic your design allows, then that is a much better situation than some super duper diamond paste which may end up with a void in it because it really hadn't been thoroughly proven in the application.  And if you calculate temperature rise, from the best to the worst adhesive, it is normally less than 1C differential.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Tuesday, October 08, 2013 10:22 AM
To: [log in to unmask]
Subject: [TN] Thermally conductive adhesive/epoxy

Good Morning All,
I am looking for some kind of thermally conductive system to bond a piece of Aluminum onto a flex circuit. The Aluminum will act as a heat sink/spreader. We will then SMT some parts on the top of the flex and then ultrasonic bond a flip chip. If a supplier wants to contact me offline-  (416) 750-8433.
Thanks. Steve Kelly


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