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October 2013

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 8 Oct 2013 14:41:24 +0000
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I recommend Zymet XP-201. Excellent bond strength to clean metal, and very good thermal performance.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Tuesday, October 08, 2013 9:22 AM
To: [log in to unmask]
Subject: [TN] Thermally conductive adhesive/epoxy

Good Morning All,
I am looking for some kind of thermally conductive system to bond a piece of Aluminum onto a flex circuit. The Aluminum will act as a heat sink/spreader. We will then SMT some parts on the top of the flex and then ultrasonic bond a flip chip. If a supplier wants to contact me offline-  (416) 750-8433.
Thanks. Steve Kelly


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