TECHNET Archives

October 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steven Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:
Tue, 8 Oct 2013 10:22:04 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (15 lines)
Good Morning All,
I am looking for some kind of thermally conductive system to bond a piece of Aluminum onto a flex circuit. The Aluminum will act as a heat sink/spreader. We will then SMT some parts on the top of the flex and then ultrasonic bond a flip chip. If a supplier wants to contact me offline-  (416) 750-8433.
Thanks. Steve Kelly


If the recipient to whom this e-mail is sent has an NDA with PFC Flexible Circuits Limited this e-mail is considered confidential and is subject to any NDA agreements between the respective parties.

See PFC on "How It's Made`` coming soon on the Discovery Channel!


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2