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October 2013

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 1 Oct 2013 13:20:42 -0500
Content-Type:
text/plain
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If the HASL is so thin that you only have an intermetallic layer left.   How efficient will the solder joint connection be.
Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Tuesday, October 01, 2013 12:53 PM
To: [log in to unmask]
Subject: Re: [TN] HASL question

Sure it wasn't immersion tin? You can't tell the difference by color, but immersion tin is extremely flat. HASL usually is not.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Tuesday, October 01, 2013 12:48 PM
To: [log in to unmask]
Subject: Re: [TN] HASL question

Is that on the level?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Hansatech
Sent: Tuesday, October 01, 2013 10:42 AM
To: [log in to unmask]
Subject: Re: [TN] HASL question

I have seen high quality horizontal hot air level which was so flat (by eye) I didn't realize it was HASL until told.
I've never seen vertical HASL that flat.
Regards
Rex

Sent by me on my iPhone.


> On 1 Oct 2013, at 18:26, Louis Hart <[log in to unmask]> wrote:
>
> Technetters, in PCB fabrication with tin-lead final finish, is it easier to get solderable surface mount pads with a horizontal HASL machine than with a vertical HASL? I have thought horizontal would make it easier. Thanks for any insight.

>
> Louis Hart
> Compunetics
> Monroeville, PA
> USA
> [log in to unmask]<mailto:[log in to unmask]>
> 412-858-1232
>
>
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