For most common epoxy based materials, the increase from 183C to190C 
should not present any reliability issues.  Lamination temps for common 
epoxy based materials are typically in the 175C to 200C range.  Higher 
temps are typically used to shorten lamination times since lamination is 
typically one of the bottlenecks in PCB processing.  However, increasing 
lamination temps significantly can potentially increase thermal 
degradation and increase material movement (potential for increased 
warpage, larger and more variable scaling factors).  Additionally, 
increasing lamination temps can result in lower viscosity (more flow) and 
faster gel times so the robustness of how much pressure and the timing of 
when full pressure is applied during the lamination process may be 
compromised.

I would recommend you talk to the prepreg supplier(s) and they should be 
able to provide info on the various items above for the particular 
materials you are utilizing.

Joel.

 
Joel S. Peiffer
3M Electronic Solutions Division
3M Center, Building 201-1E-21
St. Paul, MN  55144
Tel:  (651) 575-1464
Cell:  (612) 327-1983
Fax:  (651) 737-4601
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From:   Ramakrishnan Saravanan <[log in to unmask]>
To:     <[log in to unmask]>
Date:   10/31/2013 07:35 AM
Subject:        [TN] MLB LAMINATION TEMPERATIRE
Sent by:        TechNet <[log in to unmask]>



The Laminate suppliers specification for lamination is 183 deg C at 90 
minutes. We are laminating at 190 deg C for 90 minutes. This is to ensure 
complete cure. We are pressing single stack at a time. Is there any 
reliability concerns ?.

R.Saravanan



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