Delamination, reduce interfacial adhesion, dielectric constant change, dimensional change, discoloration of solder mask, change of Tg, brittle, reduce PWB life etc.etc. Pick and choose what you want. ıı
Original Message
From: SARAVANAN R
Sent: Thursday, October 24, 2013 7:19 PM
To: [log in to unmask]
Reply To: SARAVANAN R
Subject: [TN] Fw: [TN] PCB BAKING DURING FABRICATION
Dear all ,
If the baking temperatures are high, what are the effects on the PCB ?.
regards,
R.Saravanan
On Thursday, 24 October 2013 11:23 PM, "Whittaker, Dewey (EHCOE)" <[log in to unmask]> wrote:
Expecting good results using those higher than needed temperatures is Dicy at best.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Thursday, October 24, 2013 8:43 AM
To: [log in to unmask]
Subject: [TN] PCB BAKING DURING FABRICATION
We are using 170 deg C IPC 4101/24 material for making hi reliability PCBs. The PCB coupons are subjected to 6X Solder Dip to access PTH integrity & laminate integrity. 5X R/W also carried out.
to achieve this initial laminates(cores) are baked at 140 deg C for 4 hours.
after blak OXIDE baked at 140 deg C for 4 hours after MLB pressing baked at 140 deg C for 4 hours after electroless copper plating baked at 140 deg C for 4 hours prior to HASL baked at 140 deg C for 4 hours a total of 20 hours at 140 deg C baked during fabrication.
after PCB fabrication. the coupon is separated from PCB and the coupon is baked for 12 hours at 120 deg C.
The coupon is subjected to 6X solder dip & 5x R/W simulation.
My doubts are
Q1. These extra long hours of baking will deteriorate the chemical & mechanical properties of the laminates ?
if so , what are the properties are getting affected. The material dicy cured FR4.
Q2. Whether Test coupon results will reflect the quality of PCBs ?.
R.Saravanan
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Dear all ,
If the baking temperatures are high, what are the effects on the PCB ?.
regards,
R.Saravanan
On Thursday, 24 October 2013 11:23 PM, "Whittaker, Dewey (EHCOE)" <[log in to unmask]> wrote:
Expecting good results using those higher than needed temperatures is Dicy at best.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Thursday, October 24, 2013 8:43 AM
To: [log in to unmask]
Subject: [TN] PCB BAKING DURING FABRICATION
We are using 170 deg C IPC 4101/24 material for making hi reliability PCBs. The PCB coupons are subjected to 6X Solder Dip to access PTH integrity & laminate integrity. 5X R/W also carried out.
to achieve this initial laminates(cores) are baked at 140 deg C for 4 hours.
after blak OXIDE baked at 140 deg C for 4 hours after MLB pressing baked at 140 deg C for 4 hours after electroless copper plating baked at 140 deg C for 4 hours prior to HASL baked at 140 deg C for 4 hours a total of 20 hours at 140 deg C baked during fabrication.
after PCB fabrication. the coupon is separated from PCB and the coupon is baked for 12 hours at 120 deg C.
The coupon is subjected to 6X solder dip & 5x R/W simulation.
My doubts are
Q1. These extra long hours of baking will deteriorate the chemical & mechanical properties of the laminates ?
if so , what are the properties are getting affected. The material dicy cured FR4.
Q2. Whether Test coupon results will reflect the quality of PCBs ?.
R.Saravanan
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
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