Bob,

I would say that there is no single answer to your question, which is just another way of saying.... "it depends".

No matter what you do, there is always going to be some possibility that a defect gets past you. You can do the bare minimum of inspection, or you can layer multiple inspections (visual, x-ray, AOI, electrical test), but nothing is 100% effective.

It probably comes down to the sensitivity of your customer to defects and the amount of money they or you are willing to invest in searching for defects.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Wettermann
Sent: Tuesday, October 22, 2013 4:16 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Inspecting Class 3 Assemblies

Dear Technetters:

I think these things come in bunches.

We are being asked to perform contract inspection of Class 3 medical PCBs.
I would categorize this board as "high complexity" with BGAs, UHDI connectors, 0201s and about 4,000 parts. There are 100+ boards.

Obviously performing this manually will would take many hours and based on previous experience, be only 80% effective using a single set of eyes.

So my question for those of you building IPC-A-610 Class 3 product for mil, aerospace or medical is how do you insure that class 3 solder joint and other inspection criteria are met? The AOI we have will not do the trick!
The leadless devices and BGAs we will inspect via XRAY. Other ideas for doing this "offline"?

Bob W/BEST


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