Kitty,
It's probably not a good idea to deposit solderpaste onto soldermask.
I think the glossy or matte finish would be a personal preference for appearance for most products, but it could have an effect
If you plan to underfill devices, as I believe you could have better adhesion of the epoxies to the matte surface finish.
There is also a semi-matte which is a combination of the two.
Again I would recommend discussing this with your fabricator, and assembly manufacturer. They will take into account all
the different choices and help you decide what fits best for your particular needs and product. You cannot assume that all
your products will fit into a cookie cutter template / readme note.
All is well, good to hear from you also !
Karl
> Date: Tue, 15 Oct 2013 11:45:37 -0500
> From: [log in to unmask]
> Subject: Re: [DC] Specifying max solder mask thickness
> To: [log in to unmask]
>
> Thanks Karl,
> I will pass this on. I know there are many variants that effect solder
> mask. Do you think a matte finish is better than the glossy finish? I'm
> just wondering if the glossy finish causes the solder paste to spread more
> during the fabrication processes, what do you think?
> Good to hear from you, I hope everything is going well for you,
> Kitty
>
> Kitty Hines
> ECAD Librarian/PCB Design CID+
> Chamberlain Group, Inc.
> (630)516-6655 office
> [log in to unmask]
>
>
>
> Karl Bates <[log in to unmask]>
> Sent by: DesignerCouncil <[log in to unmask]>
> 10/15/2013 11:01 AM
> Please respond to
> "(Designers Council Forum)" <[log in to unmask]>; Please respond to
> Karl Bates <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> Re: [DC] Specifying max solder mask thickness
>
>
>
>
>
>
> Kitty,
> Solder mask materials come in many varieties ranging from dry film
> laminate to screened wet film or photoimagable liquid solder mask.
> Soldermask thickness ranges from 0.6 mil to 9 mils across mask types. Dry
> film ranges typically from 3-4 mils, photoimagable from 0.6 to 6 mils
> across various manufacturers, but is quite tight within a single supplier
> (i.e.,variations of only a mil) and wet film has the largest variation
> of0.6 mil to 9 mils.
> I would recommend that you talk to your fabricator, and see what materials
> they have available for mask and what their tolerances can be and any
> notes they currently would recommend. Compare this against the product
> needs, and choose your best application material and note from there.
>
> Karl
>
>
>
> > Date: Tue, 15 Oct 2013 08:45:46 -0500
> > From: [log in to unmask]
> > Subject: [DC] Specifying max solder mask thickness
> > To: [log in to unmask]
> >
> > Good Morning,
> > I'm looking for the best way to specify solder mask thickness,
> > particularly when it covers a via or pad, which causes a slight bump.
> This
> > situation can cause excess solder paste on pads, after application using
> a
> > 5 mil thick stencil. I've looked at the IPC-840-SM, but didn't find
> > anything that looked like a NOTE, that I can add to my Fabrication
> > Drawing. Or maybe I just missed it. What wording or diagram do you all
>
> > use for this specification? I appreciate any help you can be.
> > Thank You,
> > Kitty
> >
> > Kitty Hines
> > ECAD Librarian/PCB Design CID+
> > Chamberlain Group, Inc.
> > (630)516-6655 office
> > [log in to unmask]
> >
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