Subject: | |
From: | |
Reply To: | |
Date: | Thu, 31 Oct 2013 10:36:22 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
For most common epoxy based materials, the increase from 183C to190C
should not present any reliability issues. Lamination temps for common
epoxy based materials are typically in the 175C to 200C range. Higher
temps are typically used to shorten lamination times since lamination is
typically one of the bottlenecks in PCB processing. However, increasing
lamination temps significantly can potentially increase thermal
degradation and increase material movement (potential for increased
warpage, larger and more variable scaling factors). Additionally,
increasing lamination temps can result in lower viscosity (more flow) and
faster gel times so the robustness of how much pressure and the timing of
when full pressure is applied during the lamination process may be
compromised.
I would recommend you talk to the prepreg supplier(s) and they should be
able to provide info on the various items above for the particular
materials you are utilizing.
Joel.
Joel S. Peiffer
3M Electronic Solutions Division
3M Center, Building 201-1E-21
St. Paul, MN 55144
Tel: (651) 575-1464
Cell: (612) 327-1983
Fax: (651) 737-4601
[log in to unmask]
From: Ramakrishnan Saravanan <[log in to unmask]>
To: <[log in to unmask]>
Date: 10/31/2013 07:35 AM
Subject: [TN] MLB LAMINATION TEMPERATIRE
Sent by: TechNet <[log in to unmask]>
The Laminate suppliers specification for lamination is 183 deg C at 90
minutes. We are laminating at 190 deg C for 90 minutes. This is to ensure
complete cure. We are pressing single stack at a time. Is there any
reliability concerns ?.
R.Saravanan
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|