Hi Ben,

I send a clear picture for your reference

Lyon Yuan

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, September 04, 2013 8:04 PM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

Lyon,

I haven’t seen that.
Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.

Ben

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 7:04 AM
To: Gumpert, Ben
Cc: TechNet
Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop

hi ben,

it is pad missing from bga
在2013/09/04， "Gumpert, Ben" <[log in to unmask]<mailto:[log in to unmask]>> 写道：
Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To: [log in to unmask]<mailto:[log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________

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