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September 2013

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From:
Lyon Yuan <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 4 Sep 2013 19:03:34 +0800
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hi ben,

it is pad missing from bga
在2013/09/04, "Gumpert, Ben" <[log in to unmask]> 写道:
Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To: [log in to unmask] Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

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