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September 2013

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 4 Sep 2013 16:28:34 +0000
Content-Type:
text/plain
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text/plain (1 lines)
Unless it was reballed and placed and soldered. The second heat cycle of removal may have caused the pad to come off.

From: Bob Wettermann [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 11:24 AM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

Gents:
Lyon wrote "Bob,

After removed BGA, we found pad of BGA was missing." From what the patient is telling us it happened UPON REMOVAL (not during reballing process)
Bob W

On Wed, Sep 4, 2013 at 11:18 AM, Stadem, Richard D. <[log in to unmask]<mailto:[log in to unmask]>> wrote:
I don't think so, as then the other pads would also display varying degrees of erosion. This appears to be a pad that was lifted during the reballing process, as part of the pad prep after rework (removal of the old solder).

-----Original Message-----
From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Gumpert, Ben
Sent: Wednesday, September 04, 2013 9:20 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Or potentially too much time at liquidus dissolved the pad away, or left minimal pad that was easily lifted.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Steve Gregory
Sent: Wednesday, September 04, 2013 10:16 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Well, well, well....there's your answer. I think someone did not have a delicate touch when they cleaned the pads...

Steve


-----Original Message-----
From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan
Sent: Wednesday, September 4, 2013 8:14 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

Hi Steve



Yes, it was re-balled



Lyon Yuan



From: stephen gregory [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, September 04, 2013 10:11 PM
To: Lyon Yuan; TechNet E-Mail Forum
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop



Hi Lyon!



Have your picture posted, it's here:



http://stevezeva.homestead.com/Pad_missing.JPG



Do you know if this BGA was re-balled?



Steve



From: Lyon Yuan <[log in to unmask]<mailto:[log in to unmask]>>
To: 'stephen gregory' <[log in to unmask]<mailto:[log in to unmask]>>; 'Steve Gregory' <[log in to unmask]<mailto:[log in to unmask]>>
Sent: Wednesday, September 4, 2013 8:00 AM
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop



Steve,



Help to upload picture to web. Thanks



Lyon Yuan





-----Original Message-----
From: Wenger, George M. [Contractor] [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, September 04, 2013 9:54 PM
To: Lyon Yuan
Cc: stephen gregory; Steve Gregory
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop



Lyon,



Attached is a link to his site.  The last emails I had for Steve are on the copy to line of this email  <http://stevezeva.homestead.com/> http://stevezeva.homestead.com/





Regards,

George

George M. Wenger

Failure Signature & Characterization Lab LLC

609 Cokesbury Road, High Bridge, NJ 08829

(908) 638-8771<tel:%28908%29%20638-8771> Home (732) 309-8964<tel:%28732%29%20309-8964> Mobile

E-mail:  <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>

 <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>





-----Original Message-----

From: Lyon Yuan [mailto:[log in to unmask]<mailto:[log in to unmask]>]

Sent: Wednesday, September 04, 2013 9:45 AM

To: Wenger, George M. [Contractor]

Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop



George



Thanks, steve's email?



Lyon Yuan



-----Original Message-----

From: Wenger, George M. [Contractor] [mailto:[log in to unmask]<mailto:[log in to unmask]>]

Sent: Wednesday, September 04, 2013 9:35 PM

To: TechNet E-Mail Forum; Lyon Yuan

Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop



Hi Lyon,



You might want to send the picture to Steve to post on his site so we all can see it.



Regards,

George

George M. Wenger

Failure Signature & Characterization Lab LLC

609 Cokesbury Road, High Bridge, NJ 08829

(908) 638-8771<tel:%28908%29%20638-8771> Home (732) 309-8964<tel:%28732%29%20309-8964> Mobile

E-mail:  <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>

 <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>





-----Original Message-----

From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan

Sent: Wednesday, September 04, 2013 9:32 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop



Hi Ben,



I send a clear picture for your reference



Lyon Yuan



-----Original Message-----

From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Gumpert, Ben

Sent: Wednesday, September 04, 2013 8:04 PM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop



Lyon,



I haven’t seen that.

Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.



Ben



From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]<mailto:[log in to unmask]>]

Sent: Wednesday, September 04, 2013 7:04 AM

To: Gumpert, Ben

Cc: TechNet

Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop



hi ben,



it is pad missing from bga

在2013/09/04, "Gumpert, Ben" < <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>> 写道:

Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet  <mailto:[mailto:[log in to unmask]<mailto:[log in to unmask]>]> [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To:  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> ______________________________________________________________________



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--

  1.  Bob Wettermann
847-767-5745

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